Yiu Fai Kwan

USPTO Granted Patents = 5 (Patent Applications = 1)

Average Co-Inventor Count = 3.4

ph-index = 1

Forward Citations = 13(Granted Patents)

Company Filing History:

3 out of 4

Asm Assembly Materials Ltd.

patents

2 out of 234

Asm Technology Singapore Pte Ltd

patents

Years Active: 2006-2019

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5 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 10475666 - Routable electroforming substrate comprising removable carrier (2019-11-12),

2. 9847468 - Plated lead frame including doped silver layer (2017-12-19),

3. 8012886 - Leadframe treatment for enhancing adhesion of encapsulant thereto (2011-09-06),

4. 7691679 - Pre-plated leadframe having enhanced encapsulation adhesion (2010-04-06),

5. 7125750 - Leadframe with enhanced encapsulation adhesion (2006-10-24),

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1 patent pending:

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