Forward Citations = 15

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6 inventors (with patents filed for the assignee):

Yiu Fai Kwan (3 out of 5 patents)

Tat Chi Chan (3 out of 4 patents)

Wai Ho Chan (2 out of 6 patents)

4. Chi Chung Lee (2 out of 2 patents)

5. Man Shing Cheng (1 out of 1 patent)

6. Chun Ho Yau (1 out of 1 patent)

4 patents: Sort by Forward Citations

1. 8174096 - Stamped leadframe and method of manufacture thereof (2012-05-08),

2. 8012886 - Leadframe treatment for enhancing adhesion of encapsulant thereto (2011-09-06),

3. 7691679 - Pre-plated leadframe having enhanced encapsulation adhesion (2010-04-06),

4. 7125750 - Leadframe with enhanced encapsulation adhesion (2006-10-24),

ASM Assembly Materials Ltd. is a global leader in the development and supply of advanced materials used in semiconductor manufacturing. With a proven track record of innovation and expertise, ASM offers a wide range of high-quality materials and solutions to meet the evolving needs of the industry. Through continuous research and development, ASM is committed to delivering cutting-edge materials that enable the production of next-generation semiconductor devices.

Profile summary based on public USPTO records.

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USPTO Data Jan 1 1976 - Sep 29 2026

4 Patents

#735 in Hong Kong

#6,354 in China

Hong Kong, China

Asm Assembly Materials Ltd.