The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2010
Filed:
Mar. 23, 2007
Yiu Fai Kwan, Hong Kong, HK;
Tat Chi Chan, Hong Kong, HK;
Chun Ho Yau, Hong Kong, HK;
Chi Chung Lee, Hong Kong, HK;
Yiu Fai Kwan, Hong Kong, HK;
Tat Chi Chan, Hong Kong, HK;
Chun Ho Yau, Hong Kong, HK;
Chi Chung Lee, Hong Kong, HK;
ASM Assembly Materials Ltd., Hong Kong, HK;
Abstract
A process for producing a pre-plated leadframe that has enhanced adhesion by molding compound is provided, wherein a base leadframe material is first plated with multiple layers of metallic material. Thereafter, the plated base leadframe material is covered with a mask, so as to expose selected surfaces thereof at unmasked areas where enhanced adhesion of molding compound is desired. The said unmasked areas are plated with a layer of copper before removing the mask. Optionally, the layer of copper may further be oxidized to form a layer of specially controlled copper oxide.