Chi Chung Lee

Title: Innovations of Chi Chung Lee

Introduction

Chi Chung Lee is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of leadframe technology, holding a total of 2 patents. His work focuses on enhancing the adhesion of encapsulants to leadframes, which is crucial in the electronics industry.

Latest Patents

Chi Chung Lee's latest patents include a method for treating leadframes to improve adhesion. The first patent describes a process where a leadframe made of copper or copper alloy is oxidized in a treatment bath to form copper oxide on its surface. This is followed by dipping the leadframe in a complexing agent to enhance the purity of the copper oxide. Finally, the leadframe is cleaned with acid to remove any contaminants. The second patent outlines a process for producing a pre-plated leadframe with enhanced adhesion. In this process, a base leadframe material is plated with multiple layers of metallic material, and selected surfaces are exposed for additional plating with copper, which may be oxidized to form controlled copper oxide.

Career Highlights

Chi Chung Lee works at Asm Assembly Materials Ltd., where he applies his expertise in leadframe technology. His innovative approaches have contributed to advancements in the manufacturing processes of electronic components.

Collaborations

He collaborates with talented coworkers, including Yiu Fai Kwan and Tat Chi Chan, who share his commitment to innovation in the field.

Conclusion

Chi Chung Lee's contributions to leadframe technology demonstrate his dedication to enhancing electronic manufacturing processes. His patents reflect a deep understanding of materials and their applications in the industry.