The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 2011
Filed:
Mar. 07, 2007
Applicants:
Yiu Fai Kwan, Hong Kong, HK;
Tat Chi Chan, Hong Kong, HK;
Wai Chan, Hong Kong, HK;
Chi Chung Lee, Hong Kong, HK;
Inventors:
Yiu Fai Kwan, Hong Kong, HK;
Tat Chi Chan, Hong Kong, HK;
Wai Chan, Hong Kong, HK;
Chi Chung Lee, Hong Kong, HK;
Assignee:
ASM Assembly Materials Ltd, Hong Kong, HK;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/31 (2006.01);
U.S. Cl.
CPC ...
Abstract
A method is provided for treating a leadframe comprising copper or copper alloy to enhance adhesion of molding compound to it. The leadframe is oxidized in an oxidation treatment bath to form copper oxide on the surface of the leadframe. It is then dipped in a complexing or chelating agent to enhance the purity of the copper oxide formed. Thereafter, the leadframe is cleaned with an acid to remove any contaminants remaining on the leadframe.