The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2019
Filed:
Apr. 12, 2018
Asm Technology Singapore Pte Ltd, Singapore, SG;
Tat Chi Chan, Hong Kong, HK;
Yiu Fai Kwan, Hong Kong, HK;
Gio Jose Asumo Villaespin, Singapore, SG;
Yu Lung Lam, Hong Kong, HK;
Hang Ren, Hong Kong, HK;
ASM TECHNOLOGY SINGAPORE PTE LTD, Singapore, SG;
Abstract
A routable electroforming substrate for assembling a semiconductor package is manufactured by providing a carrier and plating a patterned first metallic layer onto the carrier which is configured to function as a surface mount pad or input/output pad in an assembled semiconductor package. A patterned second metallic layer comprising copper is plated over the first metallic layer, and a third metallic layer, which is configured for mounting a plurality of semiconductor dice, is plated over the second metallic layer. The carrier is then removed to expose the first metallic layer.