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For the Inventor, By the Inventor

Kaohsiung, Taiwan

Yi-Nien Su

USPTO Granted Patents = 45 

Average Co-Inventor Count = 2.4

ph-index = 6

Forward Citations = 111(Granted Patents)


Location History:

  • Koohsiung, TW (2004)
  • Kaohsiung, TW (2004 - 2019)
  • Hsin-Chu, TW (2015 - 2024)

Company Filing History:

goldMedal45 out of 40,780 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2004-2025

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Areas of Expertise:
Semiconductor Devices
Integrated Circuits
Interconnect Structures
Fin Field Effect Transistors
Dual Damascene Structures
Lithography Techniques
Air Gap Structures
Low Dielectric Constant Materials
Photoresist Stripping
Trench Structures
Via Structures
Plasma Etching Control
45 patents (USPTO):Explore Patents
1. 12412778 - Method for reducing line end spacing and semiconductor devices manufactured thereof (2025-09-09),
2. 12388008 - Semiconductor interconnect structure with bottom self-aligned via landing (2025-08-12),
3. 12237214 - Method of forming a semiconductor device (2025-02-25),
4. 12218007 - Self-aligned via formation using spacers (2025-02-04),
5. 12205824 - Patterning material including silicon-containing layer and method for semiconductor device fabrication (2025-01-21),
6. 12183628 - Integrated circuit and method for manufacturing the same (2024-12-31),
7. 12170205 - Methods for fabricating semiconductor structures (2024-12-17),
8. 12165914 - Air spacer surrounding conductive features and method forming same (2024-12-10),
9. 12153350 - Method of manufacturing semiconductor devices (2024-11-26),
10. 12142520 - Middle-of-line interconnect structure having air gap and method of fabrication thereof (2024-11-12),
11. 12014952 - Lithography method to reduce spacing between interconnect wires in interconnect structure (2024-06-18),
12. 11796922 - Method of manufacturing semiconductor devices (2023-10-24),
13. 11735469 - Method of forming a semiconductor device (2023-08-22),
14. 11728209 - Lithography method to reduce spacing between interconnect wires in interconnect structure (2023-08-15),
15. 11715640 - Patterning material including silicon-containing layer and method for semiconductor device fabrication (2023-08-01),

Title: The Innovative Journey of Inventor Yi-Nien Su

Introduction: Yi-Nien Su, a talented inventor hailing from Kaohsiung, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents: Yi-Nien Su holds several patents in the areas of electronics and telecommunications, showcasing his continuous commitment to innovation and creativity in his work.

Career Highlights: Throughout his illustrious career, Yi-Nien Su has been recognized for his pioneering work in developing cutting-edge technologies that have revolutionized the industry. His dedication to pushing the boundaries of what is possible has led to numerous breakthroughs in the field.

Collaborations: Yi-Nien Su has collaborated with leading tech companies and research institutions around the world, pooling together expertise to drive innovation and bring new ideas to life. His collaborative spirit has been instrumental in the success of many projects.

Conclusion: In conclusion, Yi-Nien Su stands as a beacon of innovation in the world of technology, with a remarkable track record of inventions and patents that have left a lasting impact on the industry. His passion for pushing the boundaries of what is possible continues to inspire future generations of inventors and innovators.

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