Enter inventor name

Yi-Nien Su

This inventor holds 46 USPTO granted patents and 13 published patent applications, primarily in Semiconductor Fabrication. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2004-2026.

USPTO Granted Patents = 46 (Patent Applications = 13)

% Patents Active = 80.4

Average Co-Inventor Count = 2.4

ph-index = 6

Forward Citations = 117(Granted Patents)

Location History:

Koohsiung, TW (2004)
Kaohsiung, TW (2004 - 2019)
Hsin-Chu, TW (2015 - 2024)

Company Filing History:

46 out of 42,679

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

Years Active: 2004-2026

Loading Chart...

Areas of Expertise:

Interconnect Structures

Lithography Techniques

Semiconductor Devices

Dual Damascene

Fin Field Effect Transistor

Photoresist Stripping

Air Gap Formation

Low-K Dielectric

Patterning Methods

Via Structures

Trench Structures

Integrated Circuits

46 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12635495 - Patterning material including carbon-containing layer and method for semiconductor device fabrication (2026-05-19),

2. 12412778 - Method for reducing line end spacing and semiconductor devices manufactured thereof (2025-09-09),

3. 12388008 - Semiconductor interconnect structure with bottom self-aligned via landing (2025-08-12),

4. 12237214 - Method of forming a semiconductor device (2025-02-25),

5. 12218007 - Self-aligned via formation using spacers (2025-02-04),

6. 12205824 - Patterning material including silicon-containing layer and method for semiconductor device fabrication (2025-01-21),

7. 12183628 - Integrated circuit and method for manufacturing the same (2024-12-31),

8. 12170205 - Methods for fabricating semiconductor structures (2024-12-17),

9. 12165914 - Air spacer surrounding conductive features and method forming same (2024-12-10),

10. 12153350 - Method of manufacturing semiconductor devices (2024-11-26),

11. 12142520 - Middle-of-line interconnect structure having air gap and method of fabrication thereof (2024-11-12),

12. 12014952 - Lithography method to reduce spacing between interconnect wires in interconnect structure (2024-06-18),

13. 11796922 - Method of manufacturing semiconductor devices (2023-10-24),

14. 11735469 - Method of forming a semiconductor device (2023-08-22),

15. 11728209 - Lithography method to reduce spacing between interconnect wires in interconnect structure (2023-08-15),

Title: The Innovative Journey of Inventor Yi-Nien Su

Introduction: Yi-Nien Su, a talented inventor hailing from Kaohsiung, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents: Yi-Nien Su holds several patents in the areas of electronics and telecommunications, showcasing his continuous commitment to innovation and creativity in his work.

Career Highlights: Throughout his illustrious career, Yi-Nien Su has been recognized for his pioneering work in developing cutting-edge technologies that have revolutionized the industry. His dedication to pushing the boundaries of what is possible has led to numerous breakthroughs in the field.

Collaborations: Yi-Nien Su has collaborated with leading tech companies and research institutions around the world, pooling together expertise to drive innovation and bring new ideas to life. His collaborative spirit has been instrumental in the success of many projects.

Conclusion: In conclusion, Yi-Nien Su stands as a beacon of innovation in the world of technology, with a remarkable track record of inventions and patents that have left a lasting impact on the industry. His passion for pushing the boundaries of what is possible continues to inspire future generations of inventors and innovators.

This text is generated by artificial intelligence and may not be accurate.

Please report any incorrect information to [email protected]