Yen-Kun Lai

Title: Yen-Kun Lai: Innovator in Semiconductor Technology

Introduction

Yen-Kun Lai is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of four patents. His work focuses on enhancing the efficiency and functionality of semiconductor devices.

Latest Patents

Yen-Kun Lai's latest patents include innovative designs for semiconductor devices. One of his patents describes a semiconductor device that features a semiconductor die, a first conductive pad, a second conductive pad, and both first and second connector structures. The first conductive pad is positioned on the semiconductor die and has a specific lateral dimension, while the second conductive pad also has its own lateral dimension. The first connector structure is designed to be larger than the first conductive pad, and the second connector structure is smaller than the second conductive pad. Another patent details a semiconductor die that consists of a semiconductor substrate, an interconnect structure, and a conductive bump. The interconnect structure is electrically connected to the semiconductor substrate and includes multiple stacked interconnect layers, each with embedded interconnect wiring.

Career Highlights

Yen-Kun Lai is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work at this company has allowed him to push the boundaries of semiconductor technology and contribute to advancements in the field.

Collaborations

Yen-Kun Lai collaborates with several talented individuals, including Kuo-Chin Chang and Mirng-Ji Lii, who is a woman. These collaborations have fostered a creative environment that encourages innovation and the development of new technologies.

Conclusion

Yen-Kun Lai is a notable inventor whose work in semiconductor technology has led to several important patents. His contributions continue to shape the future of the semiconductor industry.