The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 20, 2021
Filed:
Apr. 23, 2018
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Kuo-Chin Chang, Chiayi, TW;
Yen-Kun Lai, New Taipei, TW;
Kuo-Ching Hsu, Taipei, TW;
Mirng-Ji Lii, Hsinchu County, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Abstract
A semiconductor structure includes a substrate having a surface and a conductive via in the substrate. The surface has an inner region and an outer region surrounding the inner region. The semiconductor structure also includes an under bump metallurgy (UBM) pad on the surface and within the outer region, where the UBM pad has a first zone and a second zone. The first zone faces towards a center of the surface and the second zone faces away from the center of the surface. The conductive via is disposed outside the second zone and at least partially overlaps the first zone from a top view perspective.