Yee-Bing Ling

Title: Innovator Spotlight: Yee-Bing Ling from Kuching, Malaysia

Introduction

Yee-Bing Ling is a prominent inventor based in Kuching, Malaysia, known for her significant contributions to the field of component carriers. With a total of three patents to her name, she has made strides in advancing technology that enhances the functionality and efficiency of electronic components.

Latest Patents

Yee-Bing Ling's latest patents showcase her expertise in component carrier design and manufacturing. One of her notable inventions, titled "Component carrier having a laser via and method of manufacturing," involves a sophisticated design incorporating an electrically insulating layer structure and an electrically conductive layer structure. This patent details a laser via that connects these structures, offering improved connection diameters that enhance the overall performance of the component carrier.

Another significant patent introduced by Ling is the "Method for copper filling of a hole in a component carrier." This innovative method outlines a process for filling holes in component carriers with copper using a specialized plating process. The technique specifies the concentration of copper ions in the bath, ensuring optimal results for electrical connectivity.

Career Highlights

Throughout her career, Yee-Bing Ling has gained valuable experience working with notable companies such as AT&S (China) Co. Ltd. and AT&S Austria Technologie & Systemtechnik Aktiengesellschaft. Her roles in these organizations have allowed her to apply her inventive ideas and collaborate within a dynamic work environment, fostering innovation in electronic production.

Collaborations

Yee-Bing has collaborated with talented coworkers, including Kenny Cao and Jackson Xu. Together, they have contributed to the advancements within their field, making significant impacts through teamwork and shared expertise. Their collective efforts have led to the development of new technologies that enhance electronic components.

Conclusion

Yee-Bing Ling's commitment to innovation in component carrier technology positions her as a key figure in the industry. With her latest patents reflecting groundbreaking methods and designs, it is evident that her work will continue to influence the evolution of electronic manufacturing. As her career progresses, the technological landscape can expect to see more of her contributions in the future.