The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2019
Filed:
Jan. 28, 2017
Applicant:
At&s (China) Co. Ltd., Minhang District, Shanghai, CN;
Inventors:
Sally Sun, SiJing, CN;
Yee-Bing Ling, Kuching, MY;
Nikolaus Bauer-Öppinger, Gramastetten, AT;
Wilhelm Tamm, Salem, DE;
Assignee:
AT&S (China) Co. Ltd., Shanghai, CN;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0206 (2013.01); H05K 1/0296 (2013.01); H05K 1/115 (2013.01); H05K 3/0047 (2013.01); H05K 3/42 (2013.01); H05K 3/429 (2013.01); H05K 2201/09563 (2013.01); H05K 2201/09854 (2013.01);
Abstract
A component carrier includes a layer stack formed of an electrically insulating structure and an electrically conductive structure with a bore extending into the layer stack. The bore includes a first bore section with a first diameter and a connected second bore section with a second diameter differing from the first diameter. The component carrier further comprises a thermally conductive material filling substantially the entire bore. The bore is in particular formed by mechanical drilling.