The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 02, 2021

Filed:

Jul. 18, 2019
Applicant:

At&s (China) Co. Ltd., Shanghai, CN;

Inventors:

Yee-Bing Ling, Kuching, MY;

Kenny Cao, KunShan, CN;

Jackson Xu, Shanghai, CN;

Assignee:

AT&S (China) Co. Ltd., Shanghai, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/40 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4038 (2013.01); H05K 1/115 (2013.01); H05K 3/0026 (2013.01); H01L 21/486 (2013.01); H01L 23/49827 (2013.01); H05K 2201/09509 (2013.01); H05K 2203/072 (2013.01); H05K 2203/0723 (2013.01); H05K 2203/107 (2013.01);
Abstract

A component carrier is disclosed. The component carrier includes: i) at least one electrically insulating layer structure and at least one electrically conductive layer structure, wherein the electrically conductive layer structure is formed in or below the electrically insulating layer structure, and ii) a laser via formed in the electrically insulating layer structure and extending down to the electrically conductive layer structure, wherein the laser via is at least partially filled with an electrically conductive material. Hereby, a connection diameter at a first end of the laser via at the electrically conductive layer structure is equal to or larger than an opening diameter at a second end of the laser via facing away from the electrically conductive layer structure.


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