At&s (china) Co. Ltd.

At&s Austria Technologie & Systemtechnik Aktiengesellschaft

Yee-Bing Ling

Annie Tay

Wilhelm Tamm

Sally Sun

Nikolaus Bauer-Öppinger

Kenny Cao

Jackson Xu

Ares Wang

A component carrier is disclosed. The component carrier includes: i) at least one electrically insulating layer structure and at least one electrically conductive layer structure, wherein the electrically conductive layer structure is formed in or below the electrically insulating layer structure, and ii) a laser via formed in the electrically insulating layer structure and extending down to the electrically conductive layer structure, wherein the laser via is at least partially filled with an electrically conductive material. Hereby, a connection diameter at a first end of the laser via at the electrically conductive layer structure is equal to or larger than an opening diameter at a second end of the laser via facing away from the electrically conductive layer structure.

Component carrier having a laser via and method of manufacturing

A method of filling a hole formed in a component carrier with copper is disclosed. The method comprises i) forming a layer of an electrically conductive material covering at least part of a surface of a wall, wherein the wall delimits the hole, and subsequently ii) covering at least partially the layer and filling at least partially an unfilled volume of the hole with copper using a plating process including a bath. Hereby, the bath comprises a concentration of a copper ion, in particular Cu, in a range between 50 g/L and 75 g/L, in particular in a range between 60 g/L and 70 g/L.

Method for copper filling of a hole in a component carrier

A component carrier includes a layer stack formed of an electrically insulating structure and an electrically conductive structure with a bore extending into the layer stack. The bore includes a first bore section with a first diameter and a connected second bore section with a second diameter differing from the first diameter. The component carrier further comprises a thermally conductive material filling substantially the entire bore. The bore is in particular formed by mechanical drilling.

Component carrier comprising a copper filled mechanical drilled multiple-diameter bore

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Kuching, Malaysia

Yee-Bing Ling