The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2019
Filed:
Jul. 30, 2018
Applicant:
At&s Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;
Inventors:
Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01K 3/10 (2006.01); H05K 3/00 (2006.01); H05K 1/02 (2006.01); H05K 3/24 (2006.01); H05K 3/46 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0094 (2013.01); H05K 1/0298 (2013.01); H05K 3/0026 (2013.01); H05K 3/0055 (2013.01); H05K 3/241 (2013.01); H05K 3/244 (2013.01); H05K 3/423 (2013.01); H05K 3/4644 (2013.01); H05K 2201/0344 (2013.01); H05K 2201/09563 (2013.01); H05K 2203/1476 (2013.01); Y10T 29/49165 (2015.01);
Abstract
A method of filling a hole formed in a component carrier with copper is disclosed. The method comprises i) forming a layer of an electrically conductive material covering at least part of a surface of a wall, wherein the wall delimits the hole, and subsequently ii) covering at least partially the layer and filling at least partially an unfilled volume of the hole with copper using a plating process including a bath. Hereby, the bath comprises a concentration of a copper ion, in particular Cu, in a range between 50 g/L and 75 g/L, in particular in a range between 60 g/L and 70 g/L.