Ares Wang

Title: Ares Wang: Innovator in Copper Filling Technology

Introduction

Ares Wang is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of component carrier technology, particularly through his innovative methods for copper filling.

Latest Patents

Ares Wang holds a patent for a method titled "Method for copper filling of a hole in a component carrier." This patent describes a process that involves forming a layer of electrically conductive material on the surface of a wall that defines a hole. The method further includes covering this layer and filling the hole with copper using a plating process. The plating bath used in this process contains a concentration of copper ions, specifically in the range of 50 g/L to 75 g/L, with a preferred concentration between 60 g/L and 70 g/L. Ares Wang has 1 patent to his name.

Career Highlights

Ares Wang is associated with AT&S Austria Technologie & Systemtechnik Aktiengesellschaft, a leading company in the field of technology and system solutions. His work at AT&S has allowed him to focus on innovative solutions that enhance the efficiency and effectiveness of component carriers.

Collaborations

Ares has collaborated with notable colleagues, including Yee-Bing Ling and Annie Tay. Their combined expertise contributes to the advancement of technology in their respective fields.

Conclusion

Ares Wang's innovative approach to copper filling technology showcases his commitment to advancing the field of component carriers. His contributions are significant and reflect the ongoing evolution of technology in this area.