Yechung Chung

Title: Yechung Chung: Innovator in Chip-on-Film Technology

Introduction

Yechung Chung is a prominent inventor based in Hwaseong-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 8 patents. His work primarily focuses on innovative chip-on-film packages and display apparatuses.

Latest Patents

Among his latest patents, Yechung Chung has developed a chip-on-film package that includes a base film with a top surface and a bottom surface, along with a circuit region. This package features a source driver chip and a gate driver chip mounted on the circuit region. It also incorporates a first conductive line on the top surface of the base film, a second conductive line on the bottom surface, and a conductive via that connects the two lines. Additionally, the design includes bonding pads connected to the source and gate driver chips, as well as a test pad for connectivity. Another notable patent is for a package substrate film that includes a film substrate with upper and lower surfaces, along with a test pattern and test pads designed for enhanced functionality.

Career Highlights

Yechung Chung is currently employed at Samsung Electronics Co., Ltd., where he continues to push the boundaries of technology in semiconductor packaging. His innovative designs have contributed to advancements in display technologies, making significant impacts in the industry.

Collaborations

Throughout his career, Yechung Chung has collaborated with talented coworkers such as Jungeun Koo and Kyoungsei Choi. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Yechung Chung is a key figure in the field of semiconductor packaging, with a focus on chip-on-film technology. His contributions through his patents and work at Samsung Electronics Co., Ltd. highlight his importance in advancing modern display technologies.