The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2012
Filed:
Oct. 16, 2009
Youngsang Cho, Yongin-si, KR;
Donghan Kim, Osan-si, KR;
Daewoo Son, Cheonan-si, KR;
Kyoungsei Choi, Yongin-si, KR;
Yechung Chung, Hwaseong-si, KR;
Youngsang Cho, Yongin-si, KR;
Donghan Kim, Osan-si, KR;
Daewoo Son, Cheonan-si, KR;
Kyoungsei Choi, Yongin-si, KR;
Yechung Chung, Hwaseong-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Abstract
A semiconductor package has an interconnection substrate including a first conductive lead and a second longer conductive lead, and a semiconductor chip including a first cell region, a second cell region, a first conductive pad electrically connected to the first cell region and a second conductive pad electrically connected to the second cell region. The semiconductor chip is mounted to the interconnection substrate with the first and second conductive pads both disposed on and connected to the second conductive lead.