The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 02, 2014
Filed:
Sep. 24, 2011
IN Won O, Jeonju-si, KR;
Woojae Kim, Hwaseong-si, KR;
Younghoon RO, Hwaseong-si, KR;
Hanshin Youn, Hwaseong-si, KR;
Yechung Chung, Hwaseong-si, KR;
Yunseok Choi, Hwaseong-si, KR;
In Won O, Jeonju-si, KR;
Woojae Kim, Hwaseong-si, KR;
YoungHoon Ro, Hwaseong-si, KR;
HanShin Youn, Hwaseong-si, KR;
Yechung Chung, Hwaseong-si, KR;
YunSeok Choi, Hwaseong-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
Provided is a semiconductor package including: a semiconductor chip mounted on a die pad; at least one lead connected electrically to the semiconductor chip; and a flexible film substrate including a metal wiring, which electrically connects the semiconductor chip and the at least one lead, wherein the semiconductor chip is electrically connected to the film substrate through a first connection member which contacts the semiconductor chip and the metal wiring; and the film substrate is electrically connected to the at least one lead through a second connection member which contacts the metal wiring and the at least one lead.