The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2024

Filed:

Jun. 07, 2021
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Kyoungsuk Yang, Hwaseong-si, KR;

Soyoung Lim, Hwaseong-si, KR;

Yechung Chung, Hwaseong-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/66 (2006.01); H01L 23/538 (2006.01); H01L 25/18 (2023.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 21/481 (2013.01); H01L 21/486 (2013.01); H01L 22/14 (2013.01); H01L 23/49827 (2013.01); H01L 23/5384 (2013.01); H01L 23/5386 (2013.01); H01L 23/4985 (2013.01); H01L 23/5387 (2013.01); H01L 25/18 (2013.01);
Abstract

A package substrate film including a film substrate including upper and lower surfaces; a test pattern including an upper test line pattern extending on the upper surface of the film substrate; a lower test line pattern extending on the lower surface of the film substrate; a first test via pattern penetrating the film substrate and connecting the upper test line pattern to the lower test line pattern; a second test via pattern penetrating the film substrate outside the first test via pattern and connecting the upper test line pattern to the lower test line pattern; and a test pad between the first test via pattern and the second test via pattern, the test pad including first test pad at an outer side of the first test via pattern; and second test pad at an inner side of the second test via pattern and facing the first test pad.


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