Kyoungsuk Yang

Title: Kyoungsuk Yang: Innovator in Semiconductor Packaging

Introduction

Kyoungsuk Yang is a prominent inventor based in Hwaseong-si, South Korea. He has made significant contributions to the field of semiconductor packaging, holding a total of 3 patents. His work focuses on developing advanced materials and structures that enhance the performance and reliability of semiconductor devices.

Latest Patents

One of Kyoungsuk Yang's latest patents is for a package substrate film and semiconductor package that includes a film substrate with upper and lower surfaces. This innovative package substrate film features a test pattern that includes an upper test line pattern and a lower test line pattern, along with test via patterns that connect these lines. Another notable patent involves a sensing module substrate that includes a film substrate with sensing vias designed to couple with pixels of a semiconductor chip, showcasing his expertise in creating efficient and effective semiconductor solutions.

Career Highlights

Kyoungsuk Yang is currently employed at Samsung Electronics Co., Ltd., a leading global technology company. His role at Samsung has allowed him to work on cutting-edge technologies and contribute to the advancement of semiconductor packaging solutions.

Collaborations

Throughout his career, Kyoungsuk Yang has collaborated with talented individuals such as Jeong-Kyu Ha and Soyoung Lim. These collaborations have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Kyoungsuk Yang's contributions to semiconductor packaging through his innovative patents highlight his role as a key inventor in the industry. His work continues to influence the development of advanced semiconductor technologies, making a lasting impact on the field.