The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 2026
Filed:
Oct. 20, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
Kyoungsuk Yang, Suwon-si, KR;
Jinchul Choi, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A chip-on-film package including: a base film; chip pads including a first signal pad, a second signal pad, first dummy pads, and second dummy pads, wherein the chip pads are connected to a semiconductor chip attached to the base film; and wiring patterns including a first signal pattern connected to the first signal pad, a second signal pattern connected to the second signal pad, a first dummy pattern connected to the first dummy pads, and a second dummy pattern connected to the second dummy pads, wherein the first dummy pads and the second dummy pads are continuously disposed in a first direction, the first dummy pattern is disposed between the first signal pattern and the second dummy pattern, and a distance between the first dummy pattern and the first signal pattern is greater than a distance between the first dummy pattern and the second dummy pattern.