The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 07, 2019

Filed:

Dec. 30, 2016
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Inho Choi, Seoul, KR;

Youngdoo Jung, Suwon-si, KR;

Woonbae Kim, Seoul, KR;

Jungwoo Kim, Osan-si, KR;

Ji-Yong Park, Hwaseong-si, KR;

Kyoungsuk Yang, Hwaseong-si, KR;

Jeong-Kyu Ha, Hwaseong-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/20 (2006.01); G06K 9/00 (2006.01);
U.S. Cl.
CPC ...
G06K 9/00087 (2013.01); G06K 9/00013 (2013.01);
Abstract

A sensing module substrate and a sensing module including the same are provided. The sensing module substrate includes a film substrate having a first surface and a second surface; sensing vias which penetrate the film substrate from the first surface to the second surface, each of the sensing vias being configured to be coupled to pixels of a semiconductor chip; and an interconnection pattern provided on at least one of the first surface and the second surface of the film substrate.


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