The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 2013
Filed:
Jul. 22, 2009
Yechung Chung, Hwasung-si, KR;
Chulwoo Kim, Cheonan-si, KR;
Eunseok Song, Hwasung-si, KR;
Kyoungsei Choi, Yongin-si, KR;
Yechung Chung, Hwasung-si, KR;
Chulwoo Kim, Cheonan-si, KR;
Eunseok Song, Hwasung-si, KR;
Kyoungsei Choi, Yongin-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-Do, KR;
Abstract
Example embodiments are directed to a tape wiring substrate including a film having an upper surface including a chip mounting area, the chip mounting area further including an inner area and a peripheral area, the film further including a lower surface, and vias penetrating the film, the vias being located in the inner area, an upper metal layer on the upper surface of the film and connected to electrode bumps of a semiconductor chip, and a lower metal layer on the lower surface of the film. Example embodiments are directed to a tape wiring substrate including a film having an upper surface including a chip mounting area, a lower surface, and vias penetrating the film, an upper metal layer on the upper surface of the film and connected to electrode bumps of a semiconductor chip, and a lower metal layer on the lower surface of the film, the vias being located outside of the chip mounting area. Example embodiments are directed to packages including tape wiring substrates.