Hyogo, Japan

Yasushi Kasatani


Average Co-Inventor Count = 1.9

ph-index = 8

Forward Citations = 232(Granted Patents)


Location History:

  • Itami, JP (1989 - 1994)
  • Tokyo, JP (2002 - 2004)
  • Hyogo, JP (2003 - 2005)

Company Filing History:


Years Active: 1989-2005

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13 patents (USPTO):Explore Patents

Title: Yasushi Kasatani: Innovator in Semiconductor Technology

Introduction

Yasushi Kasatani is a prominent inventor based in Hyogo, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 13 patents. His innovative work has enhanced the reliability and efficiency of semiconductor devices.

Latest Patents

One of his latest patents is a bump formation method that improves the reliability of semiconductor devices by eliminating satellites generated by a solder jet-type nozzle. This method involves forming a bump on an electrode pad using a solder jet system that discharges molten solder drops. The process includes a coating layer formation step, a solder drop discharging step, and a coating layer removal step, ensuring that the work piece is protected during the soldering process.

Another notable patent is for a semiconductor module that features an upper layer semiconductor package overlying a lower layer semiconductor package. This design includes a substrate with a pad electrode and ensures that the pad electrodes of both packages are arranged alternately, optimizing space and functionality.

Career Highlights

Yasushi Kasatani has worked with several esteemed companies throughout his career, including Mitsubishi Electric Corporation and Renesas Technology Corporation. His experience in these organizations has allowed him to develop and refine his innovative ideas in semiconductor technology.

Collaborations

He has collaborated with notable colleagues such as Tetsuya Matsuura and Toshinobu Banjo, contributing to advancements in their shared field of expertise.

Conclusion

Yasushi Kasatani's contributions to semiconductor technology through his patents and collaborations have significantly impacted the industry. His innovative methods and designs continue to enhance the reliability and efficiency of semiconductor devices.

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