The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 10, 2002

Filed:

Jun. 27, 2000
Applicant:
Inventor:

Yasushi Kasatani, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/302 ;
U.S. Cl.
CPC ...
H01L 2/302 ;
Abstract

A pair of IC packages are placed in an opening of a substrate, and have straight leads laterally extending. IC package mounting lands correspondingly connected to the straight leads are arranged on upper and lower faces of a substrate. External connection lands serving as external connection terminals are disposed on extended lines along which the straight leads are drawn out, and correspondingly connected to the straight leads. The external connection lands are configured by: first-group external connection lands arranged along the side of integrated circuit packages; and second-group external connection lands arranged outside the first-group external connection lands. The first-group external connection lands and the second-group external connection lands are arranged in a staggered pattern.


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