The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 09, 2003
Filed:
Nov. 03, 2000
Applicant:
Inventor:
Yasushi Kasatani, Tokyo, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/940 ; H01L 2/334 ;
U.S. Cl.
CPC ...
H01L 2/940 ; H01L 2/334 ;
Abstract
Lands for mounting are located on the upper and lower surfaces of a substrate. External electrodes are exposed at a rear surface of a package body. An IC package is mounted by bonding the lands for mounting to the external electrodes. Lands for external connection are connected to the lands for mounting. The lands for external connection are located outside of the IC package. Solder bumps are connected to one side of the lands for external mounting. Thus, a semiconductor device for a semiconductor module is provided.
Kasatani, Yasushi. (2003). Semiconductor device and semiconductor module using the same (U.S. Patent No. 6617695). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6617695
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile