The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 28, 2004
Filed:
Aug. 30, 2002
Applicant:
Inventors:
Assignee:
Renesas Technology Corp., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/302 ; H01L 2/334 ;
U.S. Cl.
CPC ...
H01L 2/302 ; H01L 2/334 ;
Abstract
A semiconductor module includes a substrate having a pad electrode on a surface, a lower layer semiconductor package mounted on the substrate, and an upper layer semiconductor package mounted on the substrate while arranged in a position substantially overlying the former. The pad electrodes connected to the leads of these semiconductor packages are arranged alternately. The lead has a dambar residual portion. An inner surface of a lead downward portion of the upper layer semiconductor package is positioned outside an outer surface of a lead downward portion of the lower layer semiconductor package.