Kazunari Michii

This inventor holds 28 USPTO granted patents, primarily in Semiconductor Packaging. Top assignees: Mitsubishi Denki Kabushiki Kaisha, Renesas Technology Corp.. Active years: 1991-2008.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kazunari Michii. Retrieved from https://idiyas.com/inventor/kazunari-michii

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 28

% Patents Active = 67.9

Average Co-Inventor Count = 2.0

ph-index = 14

Forward Citations = 811(Granted Patents)

Location History:

Itami, JP (1991 - 1995)
Kikuchi, JP (1996)
Hyogo, JP (2002 - 2004)
Tokyo, JP (2001 - 2008)

Company Filing History:

21 out of 21,351

Mitsubishi Denki Kabushiki Kaisha

patents

7 out of 3,781

Renesas Technology Corp.

patents

Years Active: 1991-2008

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Areas of Expertise:

Semiconductor Device

Lead Frame

Integrated Circuits

Stacked Chips

Multiple Chip Package

Resin-Encapsulated

Electrical Properties

Packaging Element

Carrier Tape

IC Module

Plastic Molded-Type

28 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7348191 - Semiconductor device with terminals, and method of manufacturing the same (2008-03-25),

2. 7166490 - Semiconductor device with terminals, and method of manufacturing the same (2007-01-23),

3. 6858938 - Semiconductor device (2005-02-22),

4. 6836007 - Semiconductor package including stacked semiconductor chips (2004-12-28),

5. 6836004 - Lead frame, and method for manufacturing semiconductor device and method for inspecting electrical properties of small device using the lead frame (2004-12-28),

6. 6798056 - Semiconductor module having an upper layer semiconductor package overlying a lower layer semiconductor package (2004-09-28),

7. 6737733 - Sealed semiconductor device and lead frame used for the same (2004-05-18),

8. 6670701 - Semiconductor module and electronic component (2003-12-30),

9. 6614101 - Lead frame with raised leads and plastic packaged semiconductor device using the same (2003-09-02),

10. 6583511 - Semiconductor device and a method of producing the same (2003-06-24),

11. D475981 - Integrated circuits substrate (2003-06-18),

12. 6552418 - Resin-encapsulated semiconductor device (2003-04-22),

13. 6545366 - Multiple chip package semiconductor device (2003-04-08),

14. 6518652 - Semiconductor package (2003-02-11),

15. 6445064 - Semiconductor device (2002-09-03),

Title: Kazunari Michii - Innovative Inventor from Tokyo, JP

Introduction: Kazunari Michii is a renowned inventor based in Tokyo, Japan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Kazunari Michii holds several patents in various technological domains, including robotics, artificial intelligence, and renewable energy. His most recent patents focus on advancements in sustainable energy solutions and smart automation systems.

Career Highlights: With a career spanning over two decades, Kazunari Michii has worked with leading tech companies and research institutions in Japan. He has been instrumental in developing cutting-edge technologies that have revolutionized industries and improved efficiency.

Collaborations: Throughout his career, Kazunari Michii has collaborated with top engineers, scientists, and researchers both locally and internationally. His collaborative efforts have led to the creation of innovative solutions that address complex challenges in the tech sector.

Conclusion: Kazunari Michii's passion for innovation and his relentless pursuit of technological advancement have solidified his reputation as a visionary inventor in Tokyo, Japan. His work continues to inspire the next generation of inventors and shape the future of technology worldwide.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]