The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 18, 2004
Filed:
May. 04, 2001
Applicant:
Inventors:
Assignee:
Renesas Technology Corp., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/3495 ;
U.S. Cl.
CPC ...
H01L 2/3495 ;
Abstract
In an LOC semiconductor device, a semiconductor chip is fixed on a die pad through a die pad material. A lead including an internal lead extending to the vicinity of a pad provided to the semiconductor chip is put in place. A tape member is placed at positions corresponding to four corners of the semiconductor chip between the internal lead and the semiconductor chip. The tape member is bonded and fixed only to the internal lead but it is not bonded or fixed to the semiconductor chip and merely contacts the surface of the semiconductor chip.