The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 28, 2004
Filed:
Mar. 10, 2003
Applicant:
Inventors:
Kazunari Michii, Hyogo, JP;
Jun Shibata, Hyogo, JP;
Assignee:
Renesas Technology Corp., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/352 ; H01L 2/3495 ; H01L 2/3522 ; H01L 2/5065 ; H05K 1/02 ;
U.S. Cl.
CPC ...
H01L 2/352 ; H01L 2/3495 ; H01L 2/3522 ; H01L 2/5065 ; H05K 1/02 ;
Abstract
A semiconductor package includes an upper substrate having an opening portion, a solder ball for connection between substrates arranged on the lower side of the upper substrate, a lower substrate arranged on the further lower side and having an opening portion, a solder ball for external connection connected on the lower surface of the lower substrate, and a semiconductor chip affixed on each substrate. The semiconductor chip is electrically connected to the solder ball through the opening portion of each substrate. The solder ball for connection between substrates is electrically connected to the solder ball for external connection.