The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2005
Filed:
Oct. 23, 2000
Yasushi Kasatani, Hyogo, JP;
Yasushi Kasatani, Hyogo, JP;
Renesas Technology Corp., Tokyo, JP;
Abstract
A bump formation method and a bump formation apparatus can be gained wherein the reliability of a semiconductor device is enhanced by removing satellites that may be generated by a solder jet-type nozzle. This bump formation method is a method forming a bump on an electrode pad () provided on a work piece () by using a nozzle () of a solder jet system that discharges a molten solder drop () and is provided with the coating layer formation step of forming a coating layer () having a portion that temporarily protects the work piece (), the solder drop discharging step of discharging a molten solder drop () from the nozzle () toward the electrode pad () after the coating layer formation step and the coating layer removal step of removing the coating layer () in the region other than the region beneath the solder drop formed in the solder drop discharging step.