Introduction: Yao-Chun Su, located in Hsinchu, Taiwan, is a distinguished inventor with an impressive portfolio of 11 patents. His work primarily focuses on innovations in semiconductor packaging, making significant contributions to the electronics industry.

Latest Patents: Among his notable inventions, two recent patents stand out. The first, titled "Electronic Package with Rotated Semiconductor Die," describes an electronic package comprising a rectangular base and a chip package. It includes interface circuit dies mounted on a redistribution layer structure and encapsulated within a molding compound. This innovative design allows the chip package to be rotated relative to the base, enhancing the functionality and performance of the electronic device.

The second patent is "Semiconductor Package with Dummy MIM Capacitor Die." This semiconductor package features at least one functional die and a dummy die that is free of active circuits. The dummy die includes a metal-insulator-metal (MIM) capacitor, interconnected by a redistribution layer structure. This architecture improves the efficiency of the semiconductor package while introducing novel approaches to design.

Career Highlights: Yao-Chun Su's career includes key roles in reputable companies such as MediaTek Corporation and Nephos (Hefei) Co. Ltd. His expertise in semiconductor technology has not only benefited these organizations but has also propelled advancements in the field of electronics.

Collaborations: Throughout his career, Yao-Chun has been privileged to collaborate with talented peers, including Yi-Jou Lin and I-Hsuan Peng. These collaborations have fostered an environment of innovation and creativity, contributing to the development of groundbreaking technologies.

Conclusion: Yao-Chun Su is a leading figure in the realm of semiconductor packaging innovation. With his substantial contributions and a growing portfolio of patents, he is not only shaping the future of electronics but also inspiring the next generation of inventors. His work exemplifies the importance of collaboration and creativity in driving technological advancements.

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