The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 11, 2018
Filed:
Jan. 28, 2016
Applicant:
Mediatek Inc., Hsinchu, TW;
Inventor:
Yao-Chun Su, Hsinchu, TW;
Assignee:
MEDIATEK INC., Hsinchu, TW;
Primary Examiner:
Int. Cl.
CPC ...
G06F 13/00 (2006.01); G06F 13/38 (2006.01); G06F 13/40 (2006.01); G06F 13/42 (2006.01); G06F 13/362 (2006.01); G06F 13/364 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
G06F 13/4068 (2013.01); G06F 13/364 (2013.01); G06F 13/3625 (2013.01); G06F 13/4282 (2013.01); H01L 24/20 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/24137 (2013.01);
Abstract
A semiconductor die assembled in a wafer-level package includes a processing circuit, a multiplexer, and a transmit interface. The processing circuit generates a plurality of signal outputs. The multiplexer multiplexes the signal outputs into a multiplexed signal. The transmit interface transmits the multiplexed signal to another semiconductor die assembled in the wafer-level package.