Mediatek Corporation

Nephos (hefei) Co. Ltd.

Yao-Chun Su

I-Hsuan Peng

Yi-Jou Lin

Chih-Jung Hsu

Hong-Ching Chen

Chih-Ching Chen

Chen-Hao Chang

Shin-Shiun Chen

Yan-Bin Luo

Chih-Ching Yu

Hao-Hui Yin

An electronic package includes a base of a rectangular shape, and a chip package including a first interface circuit die and a second interface circuit die. The first interface circuit die and second interface circuit die are mounted on a redistribution layer structure and encapsulated within a molding compound. The chip package is mounted on a top surface of the base and rotated relative to the base above a vertical axis that is orthogonal to the top surface through a rotation offset angle. A metal ring is mounted on the top surface of the base.

Electronic package with rotated semiconductor die

A semiconductor package including at least one functional die; at least one dummy die free of active circuit, wherein the dummy die comprises at least one metal-insulator-metal (MIM) capacitor; and a redistribution layer (RDL) structure interconnecting the MIM capacitor to the at least one functional die.

Semiconductor package with dummy MIM capacitor die

An electronic package includes a package substrate of a rectangular shape, and a chip package including a first interface circuit die and a second interface circuit die. The first interface circuit die and second interface circuit die are mounted on a redistribution layer structure and encapsulated within a molding compound. The chip package is mounted on a top surface of the package substrate and rotated relative to the package substrate above a vertical axis that is orthogonal to the top surface through a rotation offset angle. A metal ring is mounted on the top surface of the package substrate.

An electronic package configured to operate at Gigabit-per-second (Gbps) data rates is disclosed. The electronic package includes a package substrate of a rectangular shape. A chip package having a first high-speed interface circuit die is mounted on a top surface of the package substrate. The chip package is rotated relative to the package substrate above a vertical axis that is orthogonal to the top surface through about 45 degrees. The first high-speed interface circuit die includes a first Serializer/Deserializer (SerDes) circuit block.

A multi-chip structure comprises a switch system on chip (switch SOC), a plurality of serializer/deserializer (SerDes) chips positioned around the switch SOC, and a plurality of inter-chip interfaces for connecting the switch SOC to the plurality of SerDes chips, respectively.

Multi-chip structure having flexible input/output chips

A semiconductor die assembled in a wafer-level package includes a processing circuit, a multiplexer, and a transmit interface. The processing circuit generates a plurality of signal outputs. The multiplexer multiplexes the signal outputs into a multiplexed signal. The transmit interface transmits the multiplexed signal to another semiconductor die assembled in the wafer-level package.

Signal count reduction between semiconductor dies assembled in wafer-level package

A semiconductor die assembled in a wafer-level package includes a communication interface and a bus master. The bus master is coupled to a communication bus through the communication interface. The bus master communicates with a bus slave of another semiconductor die assembled in the wafer-level package via the communication bus, and is controlled by a flow control mechanism that manages a transaction flow initiated by the bus master over the communication bus.

Supporting flow control mechanism of bus between semiconductor dies assembled in wafer-level package

A wafer-level package has a first input/output (I/O) port, a second I/O port, a first semiconductor die, and a second semiconductor die. The first I/O port and the second I/O port of the wafer-level package are arranged to connect at least one management bus. The first semiconductor die and the second semiconductor die assembled in the wafer-level package are arranged to receive commands from the first I/O port and the second I/O port, respectively.

Wafer-level package with at least one input/output port connected to at least one management bus

An electronic device has a management data input/output (MDIO) bus, a control unit, and an MDIO master. The control circuit receives a host command from a host device, and outputs a plurality of MDIO commands in response to the host command. The MDIO master receives the MDIO commands from the control circuit, and transmits the MDIO commands to the MDIO bus.

Electronic device with enhanced management data input/output control

An electronic device includes a control circuit and a bus interface. The control circuit packs a plurality of commands in a compound command frame. The bus interface communicates with another electronic device via a bus between the electronic device and the another electronic device, and packs the compound command frame in a single packet and transmits the single packet over the bus.

Electronic device for packing multiple commands in one compound command frame and electronic device for decoding and executing multiple commands packed in one compound command frame

Growing community of inventors

Hsinchu, Taiwan

Yao-Chun Su