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For the Inventor, By the Inventor

Fremont, CA, United States of America

Xia Li

This inventor holds 11 USPTO granted patents. Top assignee: Advanced Micro Devices Corporation. Active years: 2000-2004.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Xia Li. Retrieved from https://idiyas.com/inventor/xia-li-gagre5h5

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 11

% Patents Active = 81.8

Average Co-Inventor Count = 1.6

ph-index = 3

Forward Citations = 20(Granted Patents)


Company Filing History:

goldMedal11 out of 13,168 
 
Advanced Micro Devices Corporation
 patents

Years Active: 2000-2004

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11 patents (USPTO):Explore Patents
1. 6677169 - Method and system for backside device analysis on a ball grid array package (2004-01-13),
2. 6521486 - Method and system to reduce switching signal noise on a device and a device as result thereof (2003-02-18),
3. 6517666 - Automatic decapsulation system utilizing an integrated spacer/protection plate (2003-02-11),
4. 6409878 - Automatic decapsulation system utilizing an acid resistant, high heat endurance and flexible sheet coupled to a rubber gasket and a method of use (2002-06-25),
5. 6324756 - Method and system for sealing the edge of a PBGA package (2001-12-04),
6. 6262430 - Integrated system for frontside navigation and access of multi-layer integrated circuits (2001-07-17),
7. 6241907 - Method and system for providing a package for decapsulating a chip-scale package (2001-06-05),
8. 6171944 - Method for bringing up lower level metal nodes of multi-layered integrated circuits for signal acquisition (2001-01-09),
9. 6168960 - Backside device deprocessing of a flip-chip multi-layer integrated circuit (2001-01-02),
10. 6147399 - Backside exposure of desired nodes in a multi-layer integrated circuit (2000-11-14),
11. 6069079 - Exposure of desired node in a multi-layer integrated circuit using FIB (2000-05-30),

Title: Innovations by Inventor Xia Li

Introduction

Xia Li is a prominent inventor based in Fremont, CA, known for her significant contributions to the field of semiconductor technology. With a total of 11 patents to her name, she has made remarkable advancements that enhance device performance and reliability.

Latest Patents

Among her latest patents is a method and system for backside device analysis on a ball grid array package. This invention involves preparing a semiconductor die for analysis by removing solder ball connectors and exposing the interconnect pattern. The method allows for diagnostic testing by establishing electrical contact with the semiconductor die through the exposed interconnect pattern. Another notable patent focuses on reducing switching signal noise on a device. This method integrates capacitors within the device to minimize noise without altering the circuit design, thereby improving the overall performance of integrated circuit devices.

Career Highlights

Xia Li is currently employed at Advanced Micro Devices Corporation, where she continues to innovate and develop cutting-edge technologies. Her work has significantly impacted the semiconductor industry, leading to more efficient and reliable electronic devices.

Collaborations

Xia has collaborated with notable colleagues, including Jose Hulog and Mohammad Massoodi, contributing to a dynamic and innovative work environment.

Conclusion

Xia Li's contributions to semiconductor technology through her patents and collaborations highlight her role as a leading inventor in the field. Her work continues to influence advancements in electronic devices, showcasing the importance of innovation in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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