The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2004
Filed:
Aug. 02, 2001
Xia Li, Fremont, CA (US);
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Abstract
A method and system for preparing a device for analysis is disclosed. In the present invention, the device to be prepared includes a semiconductor die coupled to a first surface of a package substrate. The first surface of the package substrate includes an interconnect pattern for electrically coupling the semiconductor die to a plurality of solder ball connectors disposed on a second surface of the package substrate. The method and system for preparing the device for backside analysis comprises removing the plurality of solder ball connectors, exposing the interconnect pattern, and then exposing a backside of the semiconductor die. The method further includes preparing the backside of the semiconductor die for diagnostic testing. Electrical contact with the semiconductor die is established via the exposed interconnect pattern.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile