The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 02, 2001

Filed:

Jul. 30, 1998
Applicant:
Inventor:

Xia Li, Fremont, CA (US);

Assignee:

Advanced Micro Devices, Inc., Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
A01L 2/166 ; G01R 2/136 ;
U.S. Cl.
CPC ...
A01L 2/166 ; G01R 2/136 ;
Abstract

Aspects for deprocessing of a flip-chip, multi-layer integrated circuit from the backside are described. In an exemplary method aspect, the method includes reducing a first backside layer of the multi-layer integrated circuit to a predetermined thickness, and exposing an active region of the multi-layer integrated circuit to allow device analysis of the multi-layer integrated circuit. The method further includes removing a metal layer beneath the active region to expose interlayer dielectric material, performing a bulk delayering of the interlayer dielectric material to expose a next metal layer, and continuing to delayer the multi-layer integrated circuit layer-by-layer from the backside for analysis of the multi-layer integrated circuit.


Find Patent Forward Citations

Li, Xia. (2001). Backside device deprocessing of a flip-chip multi-layer integrated circuit (U.S. Patent No. 6168960). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6168960

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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