The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2001

Filed:

May. 07, 1998
Applicant:
Inventors:

Xia Li, Fremont, CA (US);

Glen Gilfeather, Del Valle, TX (US);

Assignee:

Advanced Micro Devices, Inc., Sunnyvale, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/14763 ;
U.S. Cl.
CPC ...
H01L 2/14763 ;
Abstract

A method for bringing up lower level metal nodes of multi-layered IC devices (,) includes a step of boring a passage (,) down through the obstructing or non-target metal layers (,) exposing these layers, through the Inter Layer Dielectric layers (,), stopping at the target metal layer (,), and a step of depositing Gallium implanted insulator (,) forming a node structure (,) with a conductive core (,) and an insulative sheath (,). The conductive core (,) brings up the target metal node or layer (,) and the insulative sheath (,) isolates the exposed non-target metal nodes or layers (,) from the target metal node (,) and the conductive core (,).


Find Patent Forward Citations

Li, Xia. (2001). Method for bringing up lower level metal nodes of multi-layered integrated circuits for signal acquisition (U.S. Patent No. 6171944). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6171944

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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