Company Filing History:
Years Active: 2019-2024
Title: The Innovations of Wen Yin
Introduction
Wen Yin is a notable inventor based in Chandler, AZ (US), recognized for his contributions to the field of integrated devices and packaging technology. With a total of 6 patents to his name, he has made significant advancements that enhance the functionality and efficiency of electronic devices.
Latest Patents
Wen Yin's latest patents include innovative designs that address critical aspects of device packaging. One of his notable inventions is a package comprising an integrated device with a back side metal layer. This device features a substrate with a passive component and an integrated device, along with a back side metal layer and solder interconnects that facilitate connections to a board. Another significant patent is focused on a mixed pad size and pad design, which includes a package with both solder mask defined (SMD) pads and non-solder mask defined (NSMD) pads, optimizing the manufacturing process.
Career Highlights
Throughout his career, Wen Yin has worked with leading technology companies, including Qualcomm Incorporated and Intel Corporation. His experience in these organizations has allowed him to develop and refine his innovative ideas, contributing to the advancement of electronic packaging technologies.
Collaborations
Wen has collaborated with talented individuals in the industry, including Yonghao An and Anna M Prakash, who have contributed to his projects and innovations.
Conclusion
Wen Yin's work exemplifies the spirit of innovation in the technology sector. His patents and collaborations reflect a commitment to advancing electronic device packaging, making him a significant figure in the field.