The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 2021
Filed:
May. 14, 2020
Applicant:
Qualcomm Incorporated, San Diego, CA (US);
Inventors:
Supatta Niramarnkarn, Santee, CA (US);
Bin Xu, San Diego, CA (US);
Wen Yin, Chandler, AZ (US);
Yonghao An, San Diego, CA (US);
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/66 (2006.01); H01L 23/367 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/56 (2013.01); H01L 23/31 (2013.01); H01L 23/3677 (2013.01); H01L 23/66 (2013.01); H01L 24/95 (2013.01);
Abstract
An integrated circuit (IC) package is described. The IC package includes a laminate substrate. The IC package also includes an active die on a surface of the laminate substrate. The IC package further includes fin-based thermal surface mount devices on the surface of the laminate substrate proximate the active die to provide an additional heat dissipation path.