Yonghao An

Title: The Innovative Contributions of Yonghao An

Introduction

Yonghao An is a prominent inventor based in San Diego, CA. He has made significant contributions to the field of technology, particularly in the area of packaging design for electronic devices. With a total of 3 patents to his name, An continues to push the boundaries of innovation.

Latest Patents

Yonghao An's latest patents showcase his expertise in package design. One of his notable inventions is a mixed pad size and pad design. This patent discloses a package and method of forming the package with a mixed pad size, which includes a first set of solder mask defined (SMD) pads and a second set of non-solder mask defined (NSMD) pads. Another significant patent involves a package comprising wire bonds configured as a heat spreader. This package includes a substrate, an integrated device, and a plurality of wire bonds that provide electrical paths between the integrated device and the substrate, encapsulated by a protective layer.

Career Highlights

Yonghao An is currently employed at Qualcomm Incorporated, a leading company in the telecommunications industry. His work at Qualcomm has allowed him to develop innovative solutions that enhance the performance and efficiency of electronic devices.

Collaborations

Throughout his career, An has collaborated with talented individuals such as Wen Yin and Reynante Tamunan Alvarado. These collaborations have contributed to the advancement of technology and the successful development of new inventions.

Conclusion

Yonghao An's contributions to the field of technology through his patents and work at Qualcomm demonstrate his commitment to innovation. His inventions not only improve electronic packaging but also pave the way for future advancements in the industry.