Supatta Niramarnkarn

Title: Supatta Niramarnkarn: Innovator in Integrated Circuit Packaging

Introduction

Supatta Niramarnkarn is a notable inventor based in Santee, California. He has made significant contributions to the field of integrated circuit packaging, holding two patents that showcase his innovative approach to technology.

Latest Patents

His latest patents include a package comprising a solder resist layer configured as a seating plane for a device. This package features a substrate with a first surface, a solder resist layer coupled to the substrate, and a device positioned over the solder resist layer. The encapsulation layer encapsulates the device, ensuring that the device's surface is approximately parallel to the substrate's first surface. Additionally, the solder resist layer includes at least one notch, allowing for precise placement of the device. Another patent describes a specialized surface mount device for symmetric heat distribution in a package. This integrated circuit package includes a laminate substrate and an active die, along with fin-based thermal surface mount devices that enhance heat dissipation.

Career Highlights

Supatta Niramarnkarn is currently employed at Qualcomm Incorporated, a leading company in the telecommunications industry. His work focuses on advancing technologies that improve the efficiency and performance of electronic devices.

Collaborations

He collaborates with talented coworkers, including Daniel F Garcia and Kinfegebriel Amera Mengistie, contributing to a dynamic team environment that fosters innovation.

Conclusion

Supatta Niramarnkarn's contributions to integrated circuit packaging reflect his dedication to innovation and technology. His patents demonstrate a commitment to enhancing device performance and efficiency in the electronics industry.