Qualcomm Incorporated

Supatta Niramarnkarn

Chang-Ho Lee

Bin Xu

Xiaoju Yu

Wen Yin

Daniel F Garcia

Francesco Carrara

Mark A Kuhlman

John Jong-Hoon Lee

Yonghao An

Ashish Alawani

Kinfegebriel Amera Mengistie

Jeongkeun Kim

A package that includes a substrate having a first surface; a solder resist layer coupled to the first surface of the substrate; a device located over the solder resist layer such that a portion of the device touches the solder resist layer; and an encapsulation layer located over the solder resist layer such that the encapsulation layer encapsulates the device. The solder resist layer is configured as a seating plane for the device. The device is located over the solder resist layer such that a surface of the device facing the substrate is approximately parallel to the first surface of the substrate. The solder resist layer includes at least one notch. The device is located over the solder resist layer such that at least one corner of the device touches the at least one notch.

Package comprising a solder resist layer configured as a seating plane for a device

An integrated circuit (IC) package is described. The IC package includes a laminate substrate. The IC package also includes an active die on a surface of the laminate substrate. The IC package further includes fin-based thermal surface mount devices on the surface of the laminate substrate proximate the active die to provide an additional heat dissipation path.

Specialized surface mount device for symmetric heat distribution in package

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Santee, CA, United States of America

Supatta Niramarnkarn