The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2019
Filed:
Dec. 21, 2015
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Wen Yin, Chandler, AZ (US);
Anna M. Prakash, Chandler, AZ (US);
Teag R. Haughan, Chandler, AZ (US);
Dingying David Xu, Chandler, AZ (US);
Joaquin Aguilar-Santillan, Gilbert, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 1/067 (2006.01); C25D 3/54 (2006.01); C25D 7/00 (2006.01); C25D 5/50 (2006.01); C23C 8/20 (2006.01); C22F 1/18 (2006.01); C25D 5/34 (2006.01); C11D 11/00 (2006.01);
U.S. Cl.
CPC ...
G01R 1/06761 (2013.01); C11D 11/0047 (2013.01); C22F 1/183 (2013.01); C23C 8/20 (2013.01); C25D 3/54 (2013.01); C25D 5/34 (2013.01); C25D 5/50 (2013.01); C25D 7/00 (2013.01); G01R 1/06722 (2013.01);
Abstract
Coated probe tips are described for plunger pins of an integrated circuit package tests system. One example has a plunger having a tip to contact a solder ball of an integrated circuit package, a sleeve to hold the plunger and allow the plunger to move toward and away from the package, the sleeve being held in a socket, a spring within the sleeve to drive the plunger toward the package, and a coating over the tip, the coating being harder than a solder ball.