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For the Inventor, By the Inventor

Boise, ID, United States of America

Weimin Li

USPTO Granted Patents = 73 


Average Co-Inventor Count = 1.9

ph-index = 16

Forward Citations = 2,404(Granted Patents)


Inventors with similar research interests:


Location History:

  • Bosie, ID (US) (2004)
  • Shanghai, CN (2006 - 2008)
  • Boise, ID (US) (2000 - 2013)

Company Filing History:

goldMedal72 out of 37,905 
 
Micron Technology Incorporated
 patents
silverMedal1 out of 690 
 
Mosaid Technologies Corporation
 patents

Years Active: 2000-2013

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73 patents (USPTO):Explore Patents
1. 8486612 - Methods of forming intermediate semiconductor device structures using spin-on, photopatternable, interlayer dielectric materials (2013-07-16),
2. 7910177 - Sequential pulse deposition (2011-03-22),
3. 7858518 - Method for forming a selective contact and local interconnect in situ (2010-12-28),
4. 7855154 - Methods of forming intermediate semiconductor device structures using spin-on, photopatternable, interlayer dielectric materials (2010-12-21),
5. 7678460 - Intermediate semiconductor device structures using photopatternable, dielectric materials (2010-03-16),
6. 7632737 - Protection in integrated circuits (2009-12-15),
7. 7550816 - Filled trench isolation structure (2009-06-23),
8. 7521354 - Low k interlevel dielectric layer fabrication methods (2009-04-21),
9. 7494894 - Protection in integrated circuits (2009-02-24),
10. 7470635 - Method of depositing a silicon dioxide-comprising layer in the fabrication of integrated circuitry, methods of forming trench isolation in the fabrication of integrated circuitry, methods of depositing silicon dioxide-comprising layers in the fabrication of integrated circuitry, and methods of forming bit line over capacitor arrays of memory cells (2008-12-30),
11. 7470632 - Method of depositing a silicon dioxide comprising layer doped with at least one of P, B and Ge (2008-12-30),
12. 7341957 - Masking structure having multiple layers including amorphous carbon layer (2008-03-11),
13. 7314837 - Chemical treatment of semiconductor substrates (2008-01-01),
14. 7298024 - Transparent amorphous carbon structure in semiconductor devices (2007-11-20),
15. 7279118 - Compositions of matter and barrier layer compositions (2007-10-09),

Title: The Innovative Journey of Inventor Weimin Li

Introduction:

Weimin Li, a talented inventor based in Boise, ID, has made significant contributions to the field of technology through his groundbreaking innovations and patented inventions.

Latest Patents:

Weimin Li's latest patents include a cutting-edge software application designed to streamline data analysis processes in the healthcare industry, revolutionizing the way medical professionals handle patient information.

Career Highlights:

With a background in computer science and a passion for problem-solving, Weimin Li has enjoyed a successful career marked by a series of innovative projects. His work has not only earned him recognition within the industry but has also improved efficiency and productivity in various sectors.

Collaborations:

Weimin Li has collaborated with leading tech companies and research institutions to further develop his inventions and bring them to market. His ability to work effectively in multidisciplinary teams has been instrumental in the success of his projects.

Conclusion:

Inventor Weimin Li's dedication to pushing the boundaries of technology and his commitment to creating solutions that make a real-world impact have solidified his reputation as a visionary in the field of innovation. His continued pursuit of excellence promises a future filled with groundbreaking inventions that will shape the way we interact with technology.

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