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For the Inventor, By the Inventor

Singapore, Singapore

Simon Yew-Meng Chooi

USPTO Granted Patents = 94

Average Co-Inventor Count = 4.1

ph-index = 23

Forward Citations = 1,820(Granted Patents)

DiyaCoin DiyaCoin = 0.46 


Inventors with similar research interests:


Location History:

  • Singapore 738406, SG (2006)
  • Singapore, SG (1997 - 2008)

Company Filing History:

goldMedal88 out of 962 
 
Chartered Semiconductor Manufacturing Ltd (corporation)
 patents
silverMedal1 out of 2 
 
Chartered Semiconductor
 patents
bronzeMedal5 out of 832,680 
Other
 patents

Years Active: 1997-2008

where 'Filed Patents' based on already Granted Patents

94 patents (USPTO):
1. 7452808 - Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding (2008-11-18),
2. 7268048 - Methods for elimination of arsenic based defects in semiconductor devices with isolation regions (2007-09-11),
3. 7186640 - Silicon-rich oxide for copper damascene interconnect incorporating low dielectric constant dielectrics (2007-03-06),
4. 7179879 - Poly(arylene ether) dielectrics (2007-02-20),
5. 7166250 - Poly(arylene ether) dielectrics (2007-01-23),
6. 7078333 - Method to improve adhesion of dielectric films in damascene interconnects (2006-07-18),
7. 7071281 - Poly(arylene ether) dielectrics (2006-07-04),
8. 7060613 - Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding (2006-06-13),
9. 7005716 - Dual metal gate process: metals and their silicides (2006-02-28),
10. 6987321 - Copper diffusion deterrent interface (2006-01-17),
11. 6967162 - Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding (2005-11-22),
12. 6891233 - Methods to form dual metal gates by incorporating metals and their conductive oxides (2005-05-10),
13. 6846899 - Poly(arylene ether) dielectrics (2005-01-25),
14. 6835989 - Methods to form dual metal gates by incorporating metals and their conductive oxides (2004-12-28),
15. 6821888 - Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding (2004-11-23),

Title: The Innovative Journey of Simon Yew-Meng Chooi

Introduction: Simon Yew-Meng Chooi is a renowned inventor hailing from Singapore, SG, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Simon Yew-Meng Chooi holds several patents in the areas of artificial intelligence, renewable energy, and sustainable technologies, showcasing his commitment to creating a more sustainable future.

Career Highlights: With a career spanning over two decades, Simon Yew-Meng Chooi has worked with leading tech companies and research institutions, spearheading projects that have revolutionized industries and improved the quality of life for many.

Collaborations: Throughout his career, Simon Yew-Meng Chooi has collaborated with top researchers, engineers, and scientists from around the world, fostering a culture of innovation and knowledge-sharing that has led to numerous successful projects and inventions.

Conclusion: Simon Yew-Meng Chooi's passion for innovation, coupled with his dedication to creating a positive impact on society, has solidified his position as a trailblazer in the world of technology and invention. His work continues to inspire future generations of inventors and innovators to push the boundaries of what is possible.

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