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For the Inventor, By the Inventor

Singapore, Singapore

Simon Yew-Meng Chooi

This inventor holds 94 USPTO granted patents, primarily in Semiconductor Technology (CPC class H01L2-14763). Top assignees: Chartered Semiconductor Manufacturing Ltd (Corporation), Chartered Semiconductor, Other. Active years: 1997-2008.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Simon Yew-Meng Chooi. Retrieved from https://idiyas.com/inventor/simon-yew-meng-chooi

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 94

% Patents Active = 80.9

Average Co-Inventor Count = 4.1

ph-index = 23

Forward Citations = 1,825(Granted Patents)

Forward Citations (Not Self Cited) = 1,811(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Singapore 738406, SG (2006)
  • Singapore, SG (1997 - 2008)

Company Filing History:

goldMedal88 out of 962 
 
Chartered Semiconductor Manufacturing Ltd (Corporation)
 patents
silverMedal1 out of 2 
 
Chartered Semiconductor
 patents
bronzeMedal5 out of 834,453 
Other
 patents

Years Active: 1997-2008

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Areas of Expertise:
Copper Bonding
Dielectric Films
Dual Metal Gates
Silicon-Rich Oxide
Copper Interconnects
Low Dielectric Constant
Clean Semiconductor Surfaces
Barrier Materials
Contamination Removal
Nanoporous Materials
Adhesion Quantification
94 patents (USPTO):Explore Patents
1. 7452808 - Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding (2008-11-18),
2. 7268048 - Methods for elimination of arsenic based defects in semiconductor devices with isolation regions (2007-09-11),
3. 7186640 - Silicon-rich oxide for copper damascene interconnect incorporating low dielectric constant dielectrics (2007-03-06),
4. 7179879 - Poly(arylene ether) dielectrics (2007-02-20),
5. 7166250 - Poly(arylene ether) dielectrics (2007-01-23),
6. 7078333 - Method to improve adhesion of dielectric films in damascene interconnects (2006-07-18),
7. 7071281 - Poly(arylene ether) dielectrics (2006-07-04),
8. 7060613 - Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding (2006-06-13),
9. 7005716 - Dual metal gate process: metals and their silicides (2006-02-28),
10. 6987321 - Copper diffusion deterrent interface (2006-01-17),
11. 6967162 - Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding (2005-11-22),
12. 6891233 - Methods to form dual metal gates by incorporating metals and their conductive oxides (2005-05-10),
13. 6846899 - Poly(arylene ether) dielectrics (2005-01-25),
14. 6835989 - Methods to form dual metal gates by incorporating metals and their conductive oxides (2004-12-28),
15. 6821888 - Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding (2004-11-23),

Title: The Innovative Journey of Simon Yew-Meng Chooi

Introduction: Simon Yew-Meng Chooi is a renowned inventor hailing from Singapore, SG, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Simon Yew-Meng Chooi holds several patents in the areas of artificial intelligence, renewable energy, and sustainable technologies, showcasing his commitment to creating a more sustainable future.

Career Highlights: With a career spanning over two decades, Simon Yew-Meng Chooi has worked with leading tech companies and research institutions, spearheading projects that have revolutionized industries and improved the quality of life for many.

Collaborations: Throughout his career, Simon Yew-Meng Chooi has collaborated with top researchers, engineers, and scientists from around the world, fostering a culture of innovation and knowledge-sharing that has led to numerous successful projects and inventions.

Conclusion: Simon Yew-Meng Chooi's passion for innovation, coupled with his dedication to creating a positive impact on society, has solidified his position as a trailblazer in the world of technology and invention. His work continues to inspire future generations of inventors and innovators to push the boundaries of what is possible.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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