The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 13, 2006
Filed:
Nov. 15, 2004
Simon Chooi, Singapore, SG;
Yakub Aliyu, Cashew Crescent, SG;
Mei Sheng Zhou, Kent Vale, SG;
John Sudijono, Hillbrooks, SG;
Subhash Gupta, Singapore, SG;
Sudipto Roy, Spring Grove, SG;
Paul Ho, Cainese, SG;
Xu Yi, Singapore, SG;
Simon Chooi, Singapore, SG;
Yakub Aliyu, Cashew Crescent, SG;
Mei Sheng Zhou, Kent Vale, SG;
John Sudijono, Hillbrooks, SG;
Subhash Gupta, Singapore, SG;
Sudipto Roy, Spring Grove, SG;
Paul Ho, Cainese, SG;
Xu Yi, Singapore, SG;
Chartered Semiconductor Manufacturing Ltd., Singapore, SG;
Abstract
A semiconductor chip having an exposed metal terminating pad thereover, and a separate substrate having a corresponding exposed metal bump thereover are provided. A conducting polymer plug is formed over the exposed metal terminating pad. A conforming interface layer is formed over the conducting polymer plug. The conducting polymer plug of the semiconductor chip is aligned with the corresponding metal bump. The conforming interface layer over the conducting polymer plug is mated with the corresponding metal bump. The conforming interface layer is thermally decomposed, adhering and permanently attaching the conducting polymer plug with the corresponding metal bump. Methods of forming and patterning a nickel carbonyl layer are also disclosed.