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For the Inventor, By the Inventor

Singapore, Singapore

Paul Kwok Ho

This inventor holds 13 USPTO granted patents. Top assignee: Chartered Semiconductor Manufacturing Ltd (Corporation). Active years: 2000-2008.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Paul Kwok Ho. Retrieved from https://idiyas.com/inventor/paul-kwok-ho

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 13

% Patents Active = 84.6

Average Co-Inventor Count = 5.6

ph-index = 6

Forward Citations = 77(Granted Patents)


Location History:

  • Cainese, SG (2006)
  • Singapore, SG (2000 - 2008)

Company Filing History:

goldMedal13 out of 962 
 
Chartered Semiconductor Manufacturing Ltd (Corporation)
 patents

Years Active: 2000-2008

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13 patents (USPTO):Explore Patents
1. 7452808 - Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding (2008-11-18),
2. 7060613 - Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding (2006-06-13),
3. 6967162 - Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding (2005-11-22),
4. 6565664 - Method for stripping copper in damascene interconnects (2003-05-20),
5. 6394114 - Method for stripping copper in damascene interconnects (2002-05-28),
6. 6391783 - Method to thin down copper barriers in deep submicron geometries by using alkaline earth element, barrier additives, or self assembly technique (2002-05-21),
7. 6365508 - Process without post-etch cleaning-converting polymer and by-products into an inert layer (2002-04-02),
8. 6350689 - Method to remove copper contamination by using downstream oxygen and chelating agent plasma (2002-02-26),
9. 6340608 - Method of fabricating copper metal bumps for flip-chip or chip-on-board IC bonding on terminating copper pads (2002-01-22),
10. 6309982 - Method for minimizing copper diffusion by doping an inorganic dielectric layer with a reducing agent (2001-10-30),
11. 6255266 - Alkyldione peroxides as cleaning solutions for wafer fabs (2001-07-03),
12. 6132521 - Cleaning metal surfaces with alkyldione peroxides (2000-10-17),
13. 6017826 - Chlorine containing plasma etch method with enhanced sidewall (2000-01-25),

Title: The Innovative Journey of Paul Kwok Ho

Introduction: Paul Kwok Ho, a visionary inventor hailing from Singapore, SG, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Paul Kwok Ho's latest patents include a cutting-edge AI-powered healthcare device, a revolutionary renewable energy solution, and a state-of-the-art communication system.

Career Highlights: With a career spanning over two decades, Paul Kwok Ho has established himself as a pioneer in the tech industry, holding multiple patents and receiving prestigious awards for his inventive work.

Collaborations: Throughout his career, Paul Kwok Ho has collaborated with leading tech companies, research institutions, and universities to further develop and implement his innovative ideas, showcasing his dedication to advancing technology.

Conclusion: Paul Kwok Ho's relentless pursuit of innovation and his passion for creating solutions that positively impact society solidify his position as a trailblazing inventor in the ever-evolving tech landscape.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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