The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 22, 2002
Filed:
Jul. 07, 2000
Simon Chooi, Singapore, SG;
Yakub Aliyu, Singapore, SG;
Mei Sheng Zhou, Singapore, SG;
John Sudijono, Singapore, SG;
Subhash Gupta, Singapore, SG;
Sudipto Ranendra Roy, Singapore, SG;
Paul Ho, Singapore, SG;
Xu Yi, Singapore, SG;
Chartered Semiconductor Manufacturing Ltd., Singapore, SG;
Abstract
A semiconductor chip having an exposed metal terminating pad thereover, and a separate substrate having a corresponding exposed metal track thereover are provided. A metal bump is formed over the exposed metal terminating pad. A photosensitive resin plug is formed over the metal bump. The metal bump of the semiconductor chip is aligned with the corresponding metal track on the separate substrate. The photosensitive resin plug over the metal bump is mated with the corresponding the metal track. The photosensitive resin plug is exposed to UV light to cure the photosensitive resin plug, permanently attaching the metal bump of the semiconductor chip to the corresponding metal track of the separate substrate.