Company Filing History:

25 out of 962

Chartered Semiconductor Manufacturing Ltd (corporation)

patents

2 out of 4,791

National Semiconductor Corporation

patents

1 out of 2

Chartered Semiconductor

patents

Years Active: 2000-2008

where 'Filed Patents' based on already Granted Patents

28 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 7452808 - Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding (2008-11-18),

2. 7060613 - Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding (2006-06-13),

3. 6987321 - Copper diffusion deterrent interface (2006-01-17),

4. 6967162 - Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding (2005-11-22),

5. 6821888 - Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding (2004-11-23),

6. 6813796 - Apparatus and methods to clean copper contamination on wafer edge (2004-11-09),

7. 6803305 - Method for forming a via in a damascene process (2004-10-12),

8. 6720204 - Method of using hydrogen plasma to pre-clean copper surfaces during Cu/Cu or Cu/metal bonding (2004-04-13),

9. 6705512 - Method of application of conductive cap-layer in flip-chip, cob, and micro metal bonding (2004-03-16),

10. 6692579 - Method for cleaning semiconductor structures using hydrocarbon and solvents in a repetitive vapor phase/liquid phase sequence (2004-02-17),

11. 6686279 - Method for reducing gouging during via formation (2004-02-03),

12. 6683002 - Method to create a copper diffusion deterrent interface (2004-01-27),

13. 6540841 - Method and apparatus for removing contaminants from the perimeter of a semiconductor substrate (2003-04-01),

14. 6475810 - Method of manufacturing embedded organic stop layer for dual damascene patterning (2002-11-05),

15. 6429117 - Method to create copper traps by modifying treatment on the dielectrics surface (2002-08-06),

Title: Yakub Aliyu - A Pioneer in Semiconductor Innovations

Introduction

Yakub Aliyu is a notable inventor based in Singapore, SG, recognized for his significant contributions to the field of semiconductor technology. With an impressive portfolio of 28 patents, he has established himself as a leading figure in innovation, particularly in IC chip bonding techniques.

Latest Patents

One of Yakub Aliyu's latest patents is focused on a method of copper/copper surface bonding using a conducting polymer for applications in integrated circuit (IC) chip bonding. This patent describes a semiconductor chip with an exposed metal terminating pad and a separate substrate featuring a corresponding exposed metal bump. The innovative process involves forming a conducting polymer plug over the exposed metal pad, creating a conforming interface layer, and aligning these components to achieve a permanent bond through thermal decomposition. Additionally, methods for forming and patterning a nickel carbonyl layer are disclosed, showcasing Yakub’s inventive solutions in semiconductor manufacturing.

Career Highlights

Yakub has had a robust career in the semiconductor industry, having worked for prestigious companies like Chartered Semiconductor Manufacturing Ltd and National Semiconductor Corporation. His experience at these firms has not only enriched his knowledge but has also allowed him to contribute substantially to advancements in semiconductor technologies.

Collaborations

Throughout his career, Yakub has collaborated with notable professionals in the field, including Simon Yew-Meng Chooi and John Leonard Sudijono. These partnerships have facilitated the exchange of ideas and have played a crucial role in the development of innovative technologies in semiconductor applications.

Conclusion

Yakub Aliyu's work in semiconductor innovations is characterized by a commitment to enhancing IC chip bonding methods through his patented technologies. His collaborations and experiences within prominent companies underline his influence and dedication to the advancement of the semiconductor industry, solidifying his status as a key inventor in this dynamic field.

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